Procesors AMD Epyc 7F32 Tray
Socket
SP3 (LGA)
Codename
Rome
Graphics
no
TDP
180W
Cores
8
Threads
16
Base Clock
3.70GHz
Turbo Clock
3.90GHz
SMT
yes
Memory controller
Octa Channel PC4-25600L (DDR4-3200)
ECC support
yes
Unlocked
no
Remote management
no
CPU-Features
MMX(+), SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AMD-V, AES, AVX, AVX2, FMA3, SHA
chipset suitability
System-on-Chip (SoC)
Scope of Delivery
without CPU cooler
Segment
Server
Architecture
Zen 2
Manufacturing Process
7nm (CPU, TSMC), 14nm (I/O, GlobalFoundries)
Stepping
SSP-B0
Launch
2020/Q2
L2 cache
4MB (8x 512kB)
L3 cache
128MB (8x 16MB)
PCIe Lanes
128x PCIe 4.0
Memory max.
4TB
Memory bandwidth
204.8GB/s
Scalability
1 socket, 2 socket
Thermal Interface material
metal/soldered
SP3 (LGA)
Codename
Rome
Graphics
no
TDP
180W
Cores
8
Threads
16
Base Clock
3.70GHz
Turbo Clock
3.90GHz
SMT
yes
Memory controller
Octa Channel PC4-25600L (DDR4-3200)
ECC support
yes
Unlocked
no
Remote management
no
CPU-Features
MMX(+), SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, x86-64, AMD-V, AES, AVX, AVX2, FMA3, SHA
chipset suitability
System-on-Chip (SoC)
Scope of Delivery
without CPU cooler
Segment
Server
Architecture
Zen 2
Manufacturing Process
7nm (CPU, TSMC), 14nm (I/O, GlobalFoundries)
Stepping
SSP-B0
Launch
2020/Q2
L2 cache
4MB (8x 512kB)
L3 cache
128MB (8x 16MB)
PCIe Lanes
128x PCIe 4.0
Memory max.
4TB
Memory bandwidth
204.8GB/s
Scalability
1 socket, 2 socket
Thermal Interface material
metal/soldered
Processor socket:
SP3
Ražotājs:
AMD