SERVER MB C622 S3647 ATX/MBD-X11SPI-TF-O SUPERMICRO

KODS: MBD-X11SPI-TF-O

Preces ID:796119

719⁷⁰ ^€

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RažotājsSUPERMICRO

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Specifikācija
Uzdot jautājumu
Energoefektivitātes lapa
Video

- Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W - Intel® C622 chipset - Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots - Expansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) - 2 10GbE LAN ports - 10 SATA3 (6Gbps) via C622 - I/O: 1 VGA, 2 COM, TPM header - 2 SuperDOM with built-in power - 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) - M.2 NGFF connector

Manufacturer Website:
https://www.supermicro.com/products/motherboard/Xeon/C620/X11SPi-TF.cfm

15pin D-sub	1
Chipset	Intel C622
COM	1
COM via Header	1
CPU's	Xeon Scalable
Form Factor	ATX
Frequency speed	1600/1866/2133/2400/2666 MHz
Integrated LAN	Gigabit
M.2	1
Maximum number of CPUs	1
Memory features	ECC/LRDIMM/RDIMM
Memory slots	8
Memory type	DDR4
Module form factor	288-pin DIMM
PCI-Express 3.0 8x	2
PCI-Express 3.0 16x	2
PCI-Express 3.0 4x	1
RAID	SATA 0, 1, 5, 10
RJ45	2
SATA 3.0	Jā
Shipping Box Depth	59 cm
Shipping Box Height	42 cm
Shipping box quantity	10
Shipping Box Weight	10 kg
Shipping Box Width	36 cm
Socket	S3647
Unit Brutto Volume	0.008921 cubm
Unit Gross Weight	1 kg
Unit Net Weight	0.95 kg
USB 2.0	6
USB 2.0	Jā
USB 3.0	5
USB 3.0	Jā
Category Code	MBS

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